Production method of wiring board and wiring board

ABSTRACT

A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 μm.

TECHNICAL FIELD

The present invention relates to a production method of a wiring boardincluding a conductor pattern formed on a board and an insulating filmthat is formed by flexographic printing and covers at least a part ofthe conductor pattern, and more particularly, to a wiring board producedby the production method.

BACKGROUND ART

Japanese Patent Application Laid Open No. 2001-51259 (referred to belowas Patent Literature 1) describes the formation of a surface protectivefilm (insulating film) covering an electrode pattern formed on a boardusing flexographic printing in the board used for liquid crystalapparatuses. FIGS. 1A, 1B, 2A, and 2B illustrate how an insulating filmis formed by the flexographic printing, which is described in PatentLiterature 1, reference numeral 11 represents the board and referencenumeral 12 represents the electrode pattern in FIGS. 1A, 1B, 2A, and 2B.In addition, reference numerals 13, 13 a, and 13 b respectivelyrepresent a coating film, a lower coating film, and an upper coatingfilm which are formed by transferring and applying a liquid precursorfor forming an insulating film.

Patent Literature 1 describes the following with reference to FIGS. 1A,1B, 2A, and 2B.

1) When the liquid precursor is applied by flexographic printing, theportion of the coating film 13 near an border segment 14 becomes aprotuberance with a height approximately twice the film thickness of theinner area as illustrated in FIG. 1A and, when this protuberance 15 isapproximately 1500 Å, cracks occur in cleaning or rubbing treatment.Such cracks cause peeling of the coating film 13. In FIG. 1A, the upperlimit of the thickness of the surface protective film is 750 Å.

2) When the lower coating film 13 a is formed by flexographic printing,the upper coating film 13 b is formed by flexographic printing again,and then the upper coating film 13 b and the lower coating film 13 a arecured as illustrated in FIG. 1B, cracks occur in the subsequent cleaningand rubbing treatment when a protuberance 16 near the border segment 14reaches approximately 2000 Å. In FIG. 1B, the upper limit of thethickness of the surface protective film is 1000 Å.

3) The lower coating film 13 a having a film thickness of approximately650 Å is formed as illustrated in FIG. 2A and then the upper coatingfilm 13 b having a film thickness of 650 Å is formed as illustrated inFIG. 2B. At this time, the upper coating film 13 b is formed so that anborder segment 18 of the upper coating film 13 b is locatedapproximately 200 μm inward of the border segment 14 of the lowercoating film 13 a. A protuberance 19 of the upper coating film 13 b doesnot overlap a protuberance 17 of the lower coating film 13 a and the sumof the film thicknesses of the lower coating film 13 a and the filmthicknesses of the upper coating film 13 b is approximately 1950 Å,which is less than 2000 Å, even at the position (position at which theprotuberance 19 is generated) at which the sum of the film thicknessesis maximum. Accordingly, since a surface protective film having a filmthickness of 1300 Å can be formed and the film thickness of the portionat which the protuberance 19 is generated is only 1950 Å in FIGS. 2A and2B, no cracks occur.

As described above, Patent Literature 1 describes that, in the formationof an insulating film by flexographic printing, cracks occur when aprotuberance generated near the border segment of an insulating film isthick, and the insulating film is formed via double-coating bydisplacing the border segments from each other to form a thickinsulating film while avoiding the occurrence of cracks.

By forming the insulating film by superposition printing of two layersas described above, it is possible to form an insulating film having afilm thickness thicker than the maximum film thickness that can beformed by single printing and prevent the occurrence of a problem suchas communication between both sides (upper and lower sides) of theinsulating film through pinholes penetrating in the film thicknessdirection that may be generated in the insulating film having beenprinted and formed.

However, when the insulating film is formed by superposition printing oftwo layers, superposition printing is performed in a form as describedin Patent Literature 1, that is, in a form in which the border segmentof the second layer, which is formed on the first layer being a lowerlayer, is recessed into the area of the film from the border segment ofthe first layer, a valley with a remarkable film thickness is formedbetween the protuberance 17 near the border segment of the first layerand the protuberance 19 near the border segment of the second layer asillustrated in FIG. 2B.

This valley causes a problem in that when, for example, a layer of anoptical clear adhesive (OCA) is disposed on the insulating film and anoptical member such as a cover is mounted on this layer, air bubbles aregenerated (air bubbles are trapped) between the insulating film and theoptical clear adhesive layer in the valley, and the presence of such airbubbles along, for example, the periphery of the insulating filmdisables proper adhesion, thereby making the mounting strengthinsufficient.

In addition, for example, when the valley of the insulating film ispresent in a visible area of the device, the surface of this portionlooks distorted, interference fringes are generated, or other visualproblems occur.

As described above, FIGS. 3 and 4 illustrate how air bubbles aregenerated when a cover 24 is mounted on first and second insulatingfilms 21 and 22 having the forms illustrated in FIG. 2B via an opticalclear adhesive layer 23. In FIGS. 3 and 4, reference character 21 arepresents the protuberance near the border segment of the firstinsulating film 21 and reference character 22 a represents theprotuberance near the border segment of the second insulating film 22.Reference numeral 25 represents the air bubble generated (remaining) inthe valley between the protuberances 21 a and 22 a. In addition,reference numeral 26 represents a board and reference numeral 27represents a conductor pattern. It should be noted that FIG. 4illustrates the state in which the air bubbles 25 are generated in thevalleys between the protuberances 21 a and 22 a around a through-hole 28when the through-hole 28 is provided in the insulating film.

BRIEF SUMMARY OF THE INVENTION

The present invention addresses such situations with an object ofproviding a production method that prevents valleys from being formed onthe surface of an insulating film in the production of a wiring boardincluding the insulating film formed by superposition printing offlexographic printing, and further providing a wiring board thatincludes an insulating film with the two-layer structure and has novalleys on the surface of the insulating film.

The technical matters described herein are not intended to expressly orimplicitly limit the invention described in the claims and express thepossibility of accepting such limitation by persons other than those whobenefit from the present invention (for example, the applicant and theright holder), but are merely provided for easy understanding of thegist of the present invention. The outline of the present invention fromanother point of view can be understood from, for example, the claims atthe time of filing of this patent application.

Although the term “wiring board” is used in this specification, “wiringboard” is paraphrased as “printed board” in this section. The printedboard according to the present invention includes a board and a printedstructure on the board. The printed structure includes an insulatinglayer on the board or the printed structure includes a conductive layerhaving a pattern formed of a conductor and an insulating layer on theconductive layer. When the printed structure includes a conductivelayer, the conductive layer is formed directly or indirectly on theboard, in other words, the conductive layer is formed on the board orthe base layer. The insulating layer has the following characteristics.

The insulating layer includes a first cured coating layer made of firstinsulating ink and a second cured coating layer made of secondinsulating ink. The material of the second insulating ink may be thesame as or different from that of the first insulating ink. The ratio ofthe thickness of the first cured coating layer to the area of the firstcured coating layer is generally sufficiently small. That is, the firstcured coating layer generally has a thin film shape. The ratio of thethickness of the second cured coating layer to the area of the secondcured coating layer is generally sufficiently small. That is, the secondcured coating layer generally has a thin film shape. The first curedcoating layer is located below the second cured coating layer and thefirst cured coating layer and the second cured coating layer are incontact with each other. The two-layer structure of the first curedcoating layer and the second cured coating layer included in theinsulating layer may be observed from the cross section of theinsulating layer. The edge of the first cured coating layer is coveredwith the second cured coating layer. In the area between the edge of thefirst cured coating layer and the edge of the second cured coatinglayer, the second cured coating layer is located on the board, the baselayer, or the conductive layer. The shortest distance from any point onthe edge of the second cured coating layer to the edge of the firstcured coating layer is more than 0 μm and not more than 400 μm,preferably not less than 50 μm and not more than 400 μm, more preferablynot less than 100 μm and not more than 400 μm, and most preferably notless than 200 μm and not more than 400 μm.

When the printed structure includes an insulating layer on the board,the method of manufacturing a printed board includes: applying the firstinsulating ink onto the board; forming the first cured coating layer bycuring the first insulating ink; applying the second insulating ink ontothe first cured coating layer in which the second insulating ink isapplied beyond the edge of the first cured coating layer by a distancemore than 0 μm and not more than 400 μm—in other words, the secondinsulating ink covers the edge of the first cured coating layer —; andforming the second cured coating layer by curing the second insulatingink.

When the printed structure includes a conductive layer and an insulatinglayer, the method of manufacturing a printed board includes: applyingthe first insulating ink onto the conductive layer; forming the firstcured coating layer by curing the first insulating ink; applying thesecond insulating ink onto the first cured coating layer in which thesecond insulating ink is applied beyond the edge of the first curedcoating layer by a distance more than 0 μm and not more than 400 μm—inother words, the second insulating ink covers the edge of the firstcured coating layer —; and forming the second cured coating layer bycuring the second insulating ink.

The application of the insulating ink is performed byprinting—preferably, flexographic printing —.

Effects of the Invention

According to the present invention, in the production of a wiring boardincluding an insulating film formed by superposition printing offlexographic printing, it is possible to provide a production methodthat prevents valleys from being formed on a surface near the bordersegment of the insulating film including the first insulating film andthe second insulating film which undergo superposition printing.

In addition, in the wiring board according to the present invention, novalleys are present on a surface near the border segment of theinsulating film having the two-layer structure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a sectional view illustrating a portion near an bordersegment of an insulating film formed by conventional flexographicprinting.

FIG. 1B is a sectional view illustrating a portion near border segmentsof insulating films formed via double-coating (superposition printing)by conventional flexographic printing.

FIG. 2A is a sectional view illustrating a portion near an bordersegment of an insulating film formed by conventional flexographicprinting.

FIG. 2B is a sectional view illustrating the state in which aninsulating film undergoes superposition printing on the insulating filmin FIG. 2A by flexographic printing with the border segments thereofdeviated from each other.

FIG. 3 is a sectional view illustrating the state in which a cover ismounted on the same structure as in FIG. 2B via an optical clearadhesive layer.

FIG. 4 is a sectional view illustrating the state in which a cover ismounted via an optical clear adhesive layer when the border segment ofthe insulating film around a through-hole has the same shape as in FIG.3.

FIG. 5A is a sectional view illustrating the shapes of the main portionsof the insulating films in a wiring board according to the presentinvention.

FIG. 5B is a sectional view illustrating shapes that are different fromthose in FIG. 5A, which are formed by a portion near the border segmentsof the insulating films.

FIG. 6 is a sectional view illustrating the state in which a cover ismounted on the structure illustrated in FIG. 5A via an optical clearadhesive layer.

FIG. 7 is a plan view illustrating an outline of a touch panel to whicha production method of the wiring board according to the presentinvention is applied.

FIG. 8A is an enlarged plan view of a main portion in FIG. 7.

FIG. 8B is a sectional view of the portion illustrated in FIG. 8A when acover is mounted via an optical clear adhesive layer.

LIST OF REFERENCE NUMERALS

-   -   11: board    -   12: electrode pattern    -   13: coating film    -   13 a: lower coating film    -   13 b: upper coating film    -   14: border segment    -   15, 16, 17, 19: protuberance    -   18: border segment    -   21: first insulating film    -   21 a: protuberance    -   22: second insulating film    -   22 a: protuberance    -   23: optical clear adhesive layer    -   24: cover    -   25: air bubble    -   26: board    -   27: conductor pattern    -   28: through-hole    -   31: board    -   32: conductor pattern    -   40: insulating film    -   41: first insulating film    -   41 a: protuberance    -   42: second insulating film    -   50: clear board    -   61: first sensor electrode row    -   61 a: island electrode    -   61 b: coupling portion    -   62: second sensor electrode row    -   62 a: island electrode    -   62 b: coupling portion    -   62 c: connection portion    -   71, 72: lead-out wire    -   72 a: connection portion    -   73: terminal portion    -   81: first conductor pattern    -   82: second conductor pattern    -   83: optical clear adhesive layer    -   84: cover    -   90: insulating film    -   91: first insulating film    -   92: second insulating film    -   93: through-hole

DETAILED DESCRIPTION

An embodiment of the present invention will be described using exampleswith reference to the drawings.

FIG. 5A illustrates a portion near an border segment of an insulatingfilm 40 of a wiring board according to the present invention. The wiringboard includes a conductor pattern 32 formed on a board 31 and theinsulating film 40 that covers at least a part of the conductor pattern32, in which the insulating film 40 includes a first insulating film 41and a second insulating film 42.

Although the overall structure is not illustrated in FIG. 5A, the firstinsulating film 41 is provided in a first region f1 on the board 31 thatcovers at least a part of the conductor pattern 32. The secondinsulating film 42 is provided in a second region f2 on the board 31that covers at least a part of the first region f1.

In FIG. 5A, reference character e1 represents the border segment (firstborder segment) of the first region f1 and reference character e2represents the border segment (second border segment) of the secondregion f2. In this example, the border segment e2 is disposed outsidethe first region f1, and the shortest distance d from any pointbelonging to the border segment e2 to the border segment e1 is not morethan 400 μm.

The insulating film 40 including the first insulating film 41 and thesecond insulating film 42 described above is formed by flexographicprinting, and the forming steps of the insulating film 40 will besequentially described below.

(1) First Printing Step

The first printing step transfers the first ink of insulating filmmaterial to the first region f1 from a first flexographic plate.

(2) First Curing Step

The first curing step cures the first ink of insulating film materialtransferred to the first region f1. This forms the first insulating film41 and forms a protuberance 41 a of the film thickness extending alongthe border segment e1 on the first insulating film 41.

(3) Second Printing Step

The second printing step transfers the second ink of insulating filmmaterial to the second region f2 from a second flexographic plate.

(4) Second Curing Step

The second curing step cures the second ink of insulating film materialtransferred to the second region f2. This forms the second insulatingfilm 42, that is, completes the insulating film 40 including the firstinsulating film 41 and the second insulating film 42.

In the steps described above, the first insulating film material and thesecond insulating film material have the same composition in thisexample and are insulating film materials such as, for example,polyimide, epoxy resin, and acrylic resin. The first and second inks ofinsulating film materials are cured only by heat treatment.Specifically, both the first curing step and the second curing stepinclude the following two processes.

1) Temporal drying for three minutes at 60° C.

2) Final drying for ten minutes at 160° C.

When the positional relationship between the border segments e1 and e2of the first and second regions f1 and f2 in which the first and secondinsulating films 41 and 42 are respectively formed is defined and thesecond ink of insulating film material is transferred to the area thatcovers the border segment e1 from above the cured first insulating film41 and extends to the outside as described above, the second ink ofinsulating film material compensates for the height difference of thefilm thickness of the first insulating film 41 due to the fluiditythereof, completely cancels the protuberance 41 a of the film thicknessexisting near the border segment e1 of the first insulating film 41, andburies the protuberance 41 a.

Such an action of the second ink of insulating film material is obtainedbecause the surface of the cured first insulating film 41 has anaffinity for the second ink of insulating film material while thesurface of the board 31 has no affinity for the ink.

That is, because of the noticeable contrast between good wettability tothe surface of the cured first insulating film 41 and good repelling tothe surface of the board 31 which forms a large contact angle at theborder segment e2, the second ink of insulating film material climbsover the protuberance 41 a of the first insulating film 41 with a lowresistance from above the first insulating film 41 and flows well to andstays in the area on the surface of the board 31 between the bordersegments e1 and e2.

As described above, in this example, the second insulating film 42exerts a high leveling effect, and the surface shape near the bordersegment of the insulating film 40 eventually descends gently, becomessubstantially horizontal once in the middle, and descends gently againas illustrated in FIG. 5A, or the surface shape descends while drawing amonotonous slope as illustrated in FIG. 5B. A protuberance of the filmthickness is not formed basically near the border segment e2 of thesecond insulating film 42 and does not have a significant size even if aprotuberance is formed. Accordingly, no valleys are formed on thesurface of the insulating film 40 in this example. It should be notedthat the maximum value of the protuberance 41 a of the film thicknessformed on the first insulating film 41 is generally not less than oneand half times the minimum value of the film thickness of the firstinsulating film 41.

The distance (shortest distance) d between the border segments e1 and e2is not more than 400 μm in the example described above. When thedistance d exceeds 400 μm, the influence of the second ink of insulatingfilm material that has climbed over the protuberance 41 a of the firstinsulating film 41 from above the first insulating film 41 and floweddoes not reach the portion near the border segment e2 and theprotuberance of the film thickness along the border segment e2 of thesecond insulating film 42 becomes apparent. Accordingly, the insulatingfilm 40 having no valleys on the surface described above can be obtainedsatisfactorily under the condition that the distance d is not more than400 μm. It should be noted that the distance d between the bordersegments e1 and e2 is preferably set to be not too small and ratherlarge within the range not more than 400 μm.

FIG. 6 illustrates the state in which the optical clear adhesive layer23 is provided by pasting an optical clear adhesive sheet to the area onthe board 31 including the border segments e1 and e2, and the cover 24is mounted via the optical clear adhesive layer 23 as in FIG. 3described above in a wiring board having the structure illustrated inFIG. 5A. The optical clear adhesive sheet is a sheet formed bysandwiching an optical clear adhesive film between two separators (twopieces of release paper) and is attached by peeling off the separators.Since no valleys are present on the surface of the insulating film 40,air bubbles are not generated in valleys unlike conventional cases and agood adhesive state can be obtained.

FIG. 7 illustrates a capacitance type touch panel as a specific exampleof the wiring board produced by the production method of the wiringboard according to the present invention. The touch panel has arectangular clear board 50 on which a plurality of first sensorelectrode rows 61 and a plurality of second sensor electrode rows 62 areformed. The plurality of first sensor electrode rows 61 extend in theX-direction parallel to the short sides of the clear board 50 and aredisposed in parallel in the Y-direction parallel to the long sides ofthe clear board 50. The plurality of second sensor electrode rows 62extend in the Y-direction and are disposed in parallel in theX-direction.

A lead-out wire 71 is drawn from one end of each of the first sensorelectrode rows 61 and a lead-out wire 72 is drawn from one end of eachof the second sensor electrode rows 62. These lead-out wires 71 and 72extend to terminal portions 73 formed near the middle of one short sideof the clear board 50.

Each of the first sensor electrode rows 61 includes a plurality ofisland electrodes 61 a arranged in the X-direction and coupling portions61 b connecting adjacent island electrodes 61 a and each of the secondsensor electrode rows 62 includes a plurality of island electrodes 62 aarranged in the Y-direction and coupling portions 62 b connectingadjacent island electrodes 62 a. Although FIG. 7 illustrates only theouter shapes of these components, in the touch panel according to theembodiment, the first and second sensor electrode rows 61 and 62(specifically, the island electrodes 61 a and the coupling portions 61b, and the island electrodes 62 a and the coupling portions 62 b) areconfigured by a conductive thin wire mesh having been printed andformed.

FIG. 8A illustrates an enlarged view of the portion in which thelead-out wire 72 is drawn from the second sensor electrode row 62 andFIG. 8B illustrates the sectional structure of the touch panel so as tocorrespond to FIG. 8A.

As illustrated in FIG. 8B, the touch panel has the structure in which afirst conductor pattern 81, an insulating film 90, and a secondconductor pattern 82 are stacked in sequence on the clear board 50. Inaddition, although not illustrated in FIGS. 7 and 8A, a cover 84 ismounted on the second conductor pattern 82 via an optical clear adhesivelayer 83. The plurality of first sensor electrode rows 61, the pluralityof lead-out wires 71 and 72, and the plurality of terminal portions 73belong to the first conductor pattern 81, and the plurality of secondsensor electrode rows 62 belong to the second conductor pattern 82 thatis insulated from the first conductor pattern 81 by the insulating film90. The first sensor electrode rows 61 and the second sensor electroderows 62 intersect each other so as to be insulated from each other, andthe coupling portions 61 b and 62 b are located so as to overlap eachother.

The insulating film 90 includes a first insulating film 91 and a secondinsulating film 92, and the positional relationship between the bordersegment e1 of the first region in which the first insulating film 91 isprovided and the border segment e2 of the second region in which thesecond insulating film 92 is provided is the same as the positionalrelationship described with reference to FIG. 5A.

The connection between the second sensor electrode rows 62 and thelead-out wires 72 is performed via portions of through-holes 93 formedin the insulating film 90, and the through-holes 93 are provided at thelower ends in the Y direction of the second sensor electrode rows 62 asillustrated in FIG. 7. The details on the portions of the through-holes93 will be described below with reference to FIGS. 8A and 8B.

The border segment e1 of the first region in which flexographic printingof the first insulating film 91 is performed forms the first closedcurve as illustrated in FIG. 8A and the border segment e2 of the secondregion in which flexographic printing of the second insulating film 92is performed forms the second closed curve located inside the firstclosed curve, so the insulating film 90 including the first insulatingfilm 91 and the second insulating film 92 is provided with thethrough-hole 93 defined by the second closed curve.

A connection portion 72 a of the lead-out wire 72 belonging to the firstconductor pattern 81 is located in the through-hole 93. The secondconductor pattern 82 is printed and formed on the insulating film 90 andin the through-hole 93, and a connection portion 62 c extending from thesecond sensor electrode row 62 belonging to the second conductor pattern82 is located in the through-hole 93. The connection portion 72 a andthe connection portion 62 c are directly superposed in the through-hole93 and connected to each other, thereby connecting the second sensorelectrode row 62 and the lead-out wire 72 to each other. Although FIGS.7 and 8A illustrate only the outer shapes of these components, in thetouch panel according to the embodiment, the connection portion 72 a andthe connection portion 62 c are configured by a conductive thin wiremesh having been printed and formed.

As described above, the touch panel has the structure in which thethrough-hole 93 is provided in the insulating film 90, the connectionportion 72 a belonging to the first conductor pattern 81 is located inthe through-hole 93, the second conductor pattern 82 is formed on theinsulating film 90 and in the through-hole 93, the connection portion 62c belonging to the second conductor pattern 82 is located in thethrough-hole 93, and the connection portion 72 a and the connectionportion 62 c are directly superposed in the through-hole 93 andconnected to each other. In this touch panel, the border segment e1 ofthe first region f1 is the first closed curve in which the connectionportion 72 a is located in the above-described first printing step andthe border segment e2 of the second region f2 is the second closed curvelocated inside the first closed curve in the above-described secondprinting step.

Then, after the second curing step described above, the touch panel isproduced by printing and forming the second conductor pattern 82 inwhich the connection portion 62 c is located inside the second closedcurve in the step of forming the second conductor pattern 82.

Furthermore, in this touch panel, after the step of forming the secondconductor pattern 82, the optical clear adhesive layer 83 is provided inthe area on the clear board 50 including the border segment e1 and theborder segment e2 by pasting an optical clear adhesive sheet as in FIG.6 described above and the cover 84 is mounted via the optical clearadhesive layer 83.

The details on the portion of the through-hole 93 provided in theinsulating film 90 has been described above using a touch panel as anexample. Since no valleys are present on the surface near the bordersegment surrounding the through-hole 93 of the insulating film 90, theinsulating film 90 being formed by superposition printing offlexographic printing and including the first insulating film 91 and thesecond insulating film 92, the second conductor pattern 82 can beprinted and formed successfully, and a problem such as generation of airbubbles around the through-hole 93 does not occur even when the opticalclear adhesive layer 83 is disposed.

It should be noted that the cover 84 as an optical member is mounted viathe optical clear adhesive layer 83 in the touch panel described above,but a display device may be mounted via the optical clear adhesive layer83 depending on the disposition form of the touch panel.

The foregoing description of the embodiment of the invention has beenpresented for the purpose of illustration and description. It is notintended to be exhaustive and to limit the invention to the precise formdisclosed. Modifications or variations are possible in light of theabove teaching. The embodiment was chosen and described to provide thebest illustration of the principles of the invention and its practicalapplication, and to enable one of ordinary skill in the art to utilizethe invention in various embodiments and with various modifications asare suited to the particular use contemplated. All such modificationsand variations are within the scope of the invention as determined bythe appended claims when interpreted in accordance with the breadth towhich they are fairly, legally, and equitably entitled.

What is claimed is:
 1. A method of producing a wiring board whichcomprises a board, a conductor pattern formed on the board, and aninsulating film covering at least part of the conductor pattern, themethod comprising: a first printing step which comprises transferring afirst ink of insulating film material from a first flexographic plateonto the board so that the first ink of insulating film is provided in afirst region covering said at least part of the conductor pattern on theboard, the first region having a first border segment; a first curingstep which comprises curing the first ink of insulating film materialprovided in the first region; a second printing step which comprisestransferring a second ink of insulating film material from a secondflexographic plate onto the board so that the second ink of insulatingfilm is provided in a second region covering at least part of the firstregion on the board, the second region having a second border segmentlocated outside the first region, wherein a shortest distance from anypoint belonging to the second border segment to the first border segmentis not greater than 400 μm; and a second curing step which comprisescuring the second ink of insulating film material provided in the secondregion, whereby the insulating film is gained as a combination of curedproducts of the first ink of insulating film material and the second inkof insulating film material.
 2. The method according to claim 1, furthercomprising pasting an optical clear adhesive sheet on a surface regionof the wiring board which covers the first border segment and the secondborder segment after the second curing step.
 3. The method according toclaim 1, wherein the first region has a void surrounded by a firstclosed curve which is defined as the first border segment, such that theconductor pattern has a first connection portion belonging theretolocated inside the first closed curve, the first connection portionbeing exposed from the first ink of insulating film material transferredonto the board in the first printing step, the second region has a voidsurrounded by a second closed curve which is defined as the secondborder segment, the second closed curve being located inside the firstclosed curve, such that the first connection portion is located insidethe second closed curve, the first connection portion still beingexposed from the second ink of insulating film material transferred ontothe board in the second printing step, whereby a through-hole surroundedby the second closed curve is formed in the insulating film by thesecond curing step, the first connection portion being located in thethrough-hole, and the method further comprises forming a secondconductor pattern by printing after the second curing step, the secondconductor pattern extending both inside the through-hole and over theinsulating film, such that the second conductor pattern has a secondconnection portion belonging thereto which is superposed directly on thefirst connection portion in the through-hole, whereby the wiring boardis gained having a structure in which the conductor pattern partlycovered by the insulating film and the second conductor pattern partlyformed over the insulating film are connected to each other through thethrough-hole.
 4. The method according to claim 3, further comprisingpasting an optical clear adhesive sheet on a surface region of thewiring board which covers the first border segment and the second bordersegment after forming a second conductor pattern.
 5. A wiring boardcomprising: a board; a conductor pattern formed on the board; and aninsulating film that covers at least part of the conductor pattern, theinsulating film comprising a first insulating layer and a secondinsulating layer overlapped to each other, wherein the first insulatinglayer is provided in a first region on the board, the first regioncovering at least part of the conductor pattern and having a firstborder segment, and the second insulating layer is provided in a secondregion on the board, the second region covering at least part of thefirst region and having a second border segment, the second bordersegment being located outside the first region, a shortest distance fromany point belonging to the second border segment to the first bordersegment being not greater than 400 μm.
 6. The wiring board according toclaim 5, wherein a first protuberance of layer thickness extending alongthe first border segment is formed in the first insulating layer.
 7. Thewiring board according to claim 6, wherein a maximum value of athickness of the first protuberance of layer thickness is not less thanone and half times a minimum value of a thickness of the firstinsulating layer.
 8. The wiring board according to claim 5, wherein anoptical member is mounted on the second insulating layer via an opticalclear adhesive layer disposed in an area including the first bordersegment and the second border segment.
 9. The wiring board according toclaim 6, wherein an optical member is mounted on the second insulatinglayer via an optical clear adhesive layer disposed in an area includingthe first border segment and the second border segment.
 10. The wiringboard according to claim 7, wherein an optical member is mounted on thesecond insulating layer via an optical clear adhesive layer disposed inan area including the first border segment and the second bordersegment.
 11. The wiring board according to claim 5, wherein the firstborder segment forms a first closed curve surrounding a void of thefirst insulating layer, the second border segment forms a second closedcurve surrounding a void of the first insulating layer, the secondclosed curve being located inside the first closed curve, a through-holedefined by the second closed curve being formed in the insulating filmthereby, the conductor pattern has a first connection portion belongingthereto, the first connection portion being located in the through-hole,the wiring board further comprises a second conductor pattern extendingboth inside the through-hole and over the insulating film, the secondconductor pattern having a second connection portion belonging thereto,the second connection portion being located in the through-hole, and thefirst connection portion and the second connection portion are directlysuperimposed in the through-hole and connected to each other.
 12. Thewiring board according to claim 6, wherein the first border segmentforms a first closed curve surrounding a void of the first insulatinglayer, the second border segment forms a second closed curve surroundinga void of the first insulating layer, the second closed curve beinglocated inside the first closed curve, a through-hole defined by thesecond closed curve being formed in the insulating film thereby, theconductor pattern has a first connection portion belonging thereto, thefirst connection portion being located in the through-hole, the wiringboard further comprises a second conductor pattern extending both insidethe through-hole and over the insulating film, the second conductorpattern having a second connection portion belonging thereto, the secondconnection portion being located in the through-hole, and the firstconnection portion and the second connection portion are directlysuperimposed in the through-hole and connected to each other.
 13. Thewiring board according to claim 7, wherein the first border segmentforms a first closed curve surrounding a void of the first insulatinglayer, the second border segment forms a second closed curve surroundinga void of the first insulating layer, the second closed curve beinglocated inside the first closed curve, a through-hole defined by thesecond closed curve being formed in the insulating film thereby, theconductor pattern has a first connection portion belonging thereto, thefirst connection portion being located in the through-hole, the wiringboard further comprises a second conductor pattern extending both insidethe through-hole and over the insulating film, the second conductorpattern having a second connection portion belonging thereto, the secondconnection portion being located in the through-hole, and the firstconnection portion and the second connection portion are directlysuperimposed in the through-hole and connected to each other.
 14. Thewiring board according to claim 11, wherein an optical member is mountedon the insulating film via an optical clear adhesive layer disposed inan area including the first border segment and the second bordersegment.
 15. The wiring board according to claim 12, wherein an opticalmember is mounted on the insulating film via an optical clear adhesivelayer disposed in an area including the first border segment and thesecond border segment.
 16. The wiring board according to claim 13,wherein an optical member is mounted on the insulating film via anoptical clear adhesive layer disposed in an area including the firstborder segment and the second border segment.